Qualcomm® AI HubAI Hub

3D-Deep-BOX

Real‑time 3D object detection.

3D Deep Box is a machine learning model that predicts 3D bounding boxes and classes of objects in an image.

Not supported

This model is currently not supported on any IoT chipset.

To see performance metrics for this model on other chipsets, click the button below.

View for other chipsets

Technical Details

Input resolution(VGG):224x224
Input resolution(YOLO):224x640
Model checkpoint:YOLOv3-tiny
Model size (vgg_3d_detection) (float):176 MB
Model size (yolo_2d_detection) (float):37.3 MB
Number of parameters (vgg_3d_detection):46.1M
Number of parameters (yolo_2d_detection):9.78M

Applicable Scenarios

  • Factory Automation
  • Robotic Navigation
  • Camera

License

Tags

  • real-time

Supported IoT Devices

  • Dragonwing IQ-8275 EVK
  • Dragonwing IQ-9075 EVK
  • Dragonwing IQ-X5121
  • Dragonwing IQ-X7181
  • Dragonwing Q-7790
  • Dragonwing Q-8750
  • Dragonwing RB3 Gen 2 Vision Kit
  • QCS8550 (Proxy)

Supported IoT Chipsets

  • Qualcomm® Dragonwing™ QCS6490
  • Qualcomm® Dragonwing™ IQ-X7181
  • Qualcomm® Dragonwing™ Q-7790
  • Qualcomm® Dragonwing™ QCS8275
  • Qualcomm® Dragonwing™ QCS8550 (Proxy)
  • Qualcomm® Dragonwing™ Q-8750
  • Qualcomm® Dragonwing™ IQ-9075

Related Models

See all models

Looking for more? See models created by industry leaders.

Discover Model Makers